The creep phenomenon is considered as one of the most important deformation mechanism s under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb containing solder alloy. The stress exponents, n, were found to be around 3.7 for all soldiers at 130 ° C. The stress exponent increases as the temperature drops from 100 ° C to 50 ° C, except for the 1.0% Sb alloy, where n 5.3 - 6.1 at all the temperature range (T = 50 ° C, 100 ° C and 130 ° C). The results reveal that the Sb-containing solder alloys have better creep resistance with greater ductility than the Sb-free alloy due to solid solution strengthening, and intermetallic compound SnSb particle hardening.
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