Modeling of Subcooled Boiling Heat Transfer to Cool Electronic Components in a Micro-Channel
- 1 Mechanical Engineering Department, Amirkabir University of Technology, Tehran, Iran
- 2 Mechanical Engineering Department, Amirkabir University of Technology, Tehran, Iran
Abstract
This paper aims to model a subcooled flow boiling in a vertical stainless-steel micro-channel with an upward flow in 1 mm diameter, 40 mm length and 0.325 mm thickness tube. Water has been considered as a working fluid. The heat flux varies from 600 - 750 kW · m -2 , input velocity from 1 - 2 m · s -1 , and the subcooled temperature varies from 59.6 - 79.6 K. The working pressure and saturation temperature are 1 atm and 372.75 K, respectively. The results show that, the flow boiling keeps the temperature of the channel wall lower and more uniform than a single-phase flow, as long as the flow boiling does not reach the dry-out point. The onset point of dry-out depends on three factors, heat flux, inlet velocity, and subcooled temperature. In addition, the dry-out occurs at a point near the channel inlet with increased heat flux and subcooled temperature. Decreasing the inlet velocity would also cause the dry-out point to shift closer to the inlet of the channel.
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