Thermal Conductivity Enhancement of Epoxy by Hybrid Particulate Fillers of Graphite and Silicon Carbide
- 1 Department of Mechanical Engineering, Don Bosco Institute of Technology, Bangalore, India
- 2 Department of Mechanical Engineering, Raja Rajeshwari College of Engineering, Bangalore, India
Abstract
This paper reports thermal conductivity studies carried out on room temperature cure (RT) epoxy resin (LY556 + HY951) containing three different particulate fillers such as Graphite (Gr) a soft material, Silicon carbide (SiC) a hard material and a hybrid graphite & silicon carbide (Gr-SiC). The weight fractions of three different fillers were varied from 10 wt% to 40 wt% in steps of 10%. Increased filler fraction increases the thermal conductivity of epoxy composites for all the three types of fillers. The results show that the synergic effect of hybrid filler (Gr-SiC) improves the thermal conductivity of epoxy composites compared to that of Graphite or Silicon carbide. The improvement in thermal conductivity for the epoxy hybrid composite containing 20% SiC, 20% Gr and 60% epoxy is 136% when compared with neat epoxy. Significant improvement in the thermal conductivity is observed for 40% filled epoxies. The experimental results were compared with analytical models such as Maxwell, Hashin, Hamilton-Crosser, Nielsen, and Cheng-Vachon. The predicted thermal conductivity by analytical models is in agreement with experimental results.
- Ebadi-Dehaghani, H. and Branch, M.N.S. (2012) Thermal Conductivity of Nanoparticles Filled Polymers Islamic Azad University Iran Smart Nanoparticles Technology. 519-540.
- Tsekmes, I.A., Kochetov, R., Morshuis, P.H.F. and Smit, J.J. (2013) Thermal Conductivity of Polymeric Composites: A Review. 2013 IEEE International Conference on Solid Dielectrics, Bologna, 30 June-4 July 2013, 678-681.
- Leea, G.-W., Parka, M., Kima, J., Leeb, J.I. and Yoonb, H.G. (2006) Enhanced Thermal Conductivity of Polymer Composites Filled with Hybrid Filler. Composites: Part A, 37, 727-734. http://dx.doi.org/10.1016/j.compositesa.2005.07.006
- Wang, M.C., Zhang, Z.G. and Sun, Z.J. (2009) The Hybrid Model and Mechanical Properties of Hybrid Composites Reinforced with Different Diameter Fibers. Journal of Reinforced Plastics and Composites, 28, 257.
- Kanga, S., Honga, S.I., Choeb, C.R., Parkb, M., Rimb, S. and Kimb, J. (2001) Preparation and Characterization of Epoxy Composites Filled with Functionalized Nanosilica Particles Obtained via Solgel Process. Polymer, 42, 879-887. http://dx.doi.org/10.1016/S0032-3861(00)00392-X
- Luyt, A.S., Molefi, J.A. and Krump, H. (2005) Thermal Mechanical and Electrical Properties of Copper Filled Low Density Ald Linear Low Density Polyethylene Composites. Polymer Degradation and Stability, 1-8.
- Yung, K.C., Wang, J. and Yue, T.M. (2008) Thermal Management for Boron Nitride Filled Metal Core Printed Circuit Board. Journal of Composite Materials, 42, 2615. http://dx.doi.org/10.1177/0021998308096326
- Zhou, W.Y., Wang, C.F., An, Q.L. and Ou, H.Y. (2008) On Thermal Properties of Heat Conductive Silicone Rubber Filled with Hybrid Fillers. Journal of Composite Materials, 42, 173.
- Mamunya, Ye.P., Davydenko, V.V., Piss, P. and Lebedev, E.V. (2002) Electrical and Thermal Conductivity of Polymers Filled with Metal Powders. European Polymer Journal, 38, 1887-1897. http://dx.doi.org/10.1016/S0014-3057(02)00064-2
- Zhou1, T., Wang, X., Cheng, P., Wang, T., Xiong, D. and Wang, X. (2013) Improving the Thermal Conductivity of Epoxy Resin by the Addition of a Mixture of Graphite Nanoplatelets and Silicon Carbide Microparticles. Express Polymer Letters, 7, 585-594. http://dx.doi.org/10.3144/expresspolymlett.2013.56
- Reine, B., Tomaso, J.D., Dusserre, G. and Olivier, P.A. (2012) Study of Thermal Behaviour of Thermoset Polymer Matrix Filled with Micro and Nano Particles. Proceedings of ECCM15, Italy, 24-28 June 2012.