Extendibility Evaluation of Industrial EUV Source Technologies for kW Average Power and 6.x nm Wavelength Operation
- 1 1Research Institute for Science and Engineering, Waseda University, Tokyo, Japan 2HiLASE Project, Institute of Physics AS, Prague, Czech Republic
Abstract
Interests in the extendibility are growing after the introduction of the LPP (Laser Produced Plasma) EUV source technology in the semiconductor industry, towards higher average power and shorter wavelength, based on the basic architecture of the established LPP EUV source technology. It is discussed in this article that the power scaling of the 13.5nm wavelength source is essentially possible by a slight increase of the driving laser power, CE (Conversion Efficiency) and EUV collection efficiency by some introduction of novel component technologies. Extension of the EUV wavelength towards BEUV (Beyond EUV), namely 6.x nm is discussed based on the general rule of the UTA (Unresolved Transition Arrays) of high Z ions, and development of multilayer mirrors in this particular wavelength region. Technical difficulties are evaluated for the extension of the LPP source technology by considering the narrower mirror bandwidth and higher melting temperature of the candidate plasma materials. Alternative approach based on the superconducting FEL is evaluated in comparison with the LPP source technology for the future solution.
- Grillo, G., Pagani, C., Saldin, E.L., Schneidmiller, E.A. and Yurkov, M.V. (2001) Nuclear Instruments and Methods in Physics Research A, 475, 39-42.
- Endo, A. (2010) CO2 Laser Produced Tin Plasma Light Source as the Solution for EUV Lithography. In: Wang, M., Ed., Lithography, Chapter 9, InTech. http://www.intechopen.com/
- http://www.cymer.com/
- http://www.gigaphoton.com/
- Fomenkov, I.V., La Fontaine, B., Brown, D., Ahmad, I., Baumgart, P., Bowering, N.R., Brandt, D.C., Bykanov, A.N., De Dea, S., Ershov, A.I., Farrar, N.R., Golich, D.J., Lercel, M.J., Myers, D.W., Rajyaguru, C., et al. (2012) Journal of Micro/Nanolithography, MEMS MOEMS, 11, Article ID: 021110. http://nanolithography.spiedigitallibrary.org/
- Otsuka, T., Kilbane, D., Higashiguchi, T., Yugami, N., Yatagai, T., Jiang, W., Endo, A., Dunne, P. and O’Sullivan, G. (2010) Applied Physics Letters, 97, Article ID: 231503. http://dx.doi.org/10.1063/1.3526383
- Platonov, Y., et al. (2011) Status of Multilayer Coatings for EUV Lithography. P25, International Workshop on EUVL, EUV Litho Inc. Maui, Hawaii, 13-17 June. https://www.euvlitho.com/
- Louis, E., et al. (2011) Multilayer Development for Extreme Ultraviolet and Shorter Wavelength Lithography. S24, International Workshop on EUV and Soft X-Ray Sources, EUV Litho Inc.Dublin, Ireland, 7-10 November. https://www.euvlitho.com/
- Dinger, U., Tuerke, D., Meseck, A., Patra, M., Sohmen, E. and Jankowiak, A. (2012) Concept Study on an Accelerator based Source for 6.x nm Lithography. S16, International Workshop on Extreme Ultraviolet Sources, Dublin, 8-11 October. https://www.euvlitho.com/
- Endo, A. (2012) High Average Power Pulsed CO2 Laser for Short Wavelength Light Sources. In: Dumitras, D.C., Ed., CO2 Laser-Optimization and Applications, Chapter 5, InTech. http://www.intechopen.com/
- Nowak, K.M., Ohta, T., Suganuma, T., Fujimoto, J., Mizoguchi, H. and Endo, A. (2013) Opto-Electronics Review, 21, 345-354.
- Sererova, P., Endo, A., Mocek, T. and Miura, T. (2013) Proceedings of SPIE, 8780, 87800W1-9.
- Mizoguchi, H., Nakarai, H., Abe, T., Ohta, T., Nowak, K.M., Kawasuji, Y., Tanaka, H., Watanabe, Y., Hori, T., Kodama, T., Shiraishi, Y., Yanagida, T., Yamada, T., Yamazaki, T., Okazaki, S. and Saitou, T. (2013) LPP-EUV Light Source Development for High Volume Manufacturing Lithography. SPIE Advanced Lithography, paper 8679-9, 24-28 Feb, San Jose, CA, US.