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Numerical Simulation of Shock Resistant Microsystems (MEMS)
Institute of Electronic Engineering, CAEP, Mianyang, China; Ministry of Education Key Laboratory of Testing Technology for Manufacturing Process, Southwest University of Science and Technology, Mianyang, China
Institute of Electronic Engineering, CAEP, Mianyang, China
Institute of Electronic Engineering, CAEP, Mianyang, China
- 1 Institute of Electronic Engineering, CAEP, Mianyang, China; Ministry of Education Key Laboratory of Testing Technology for Manufacturing Process, Southwest University of Science and Technology, Mianyang, China
- 2 Institute of Electronic Engineering, CAEP, Mianyang, China
- 3 Institute of Electronic Engineering, CAEP, Mianyang, China
Modern Mechanical Engineering·Volume 04 (2014)·Pages 119–124·Published 15 August 2014·DOI10.4236/mme.2014.43011
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Abstract
The mechanical response of shock-loaded microelectromechanical systems (MEMS) is simulated to formulate guidelines for the design of dynamically reliable MEMS. MEMS are modeled as microstructures supported on elastic substrates, and the shock loads are represented as pulses of acceleration applied by the package on the substrate over a finite time duration. For typical MEMS and shock loads, the response of the substrate is closely approximated by rigid-body motion. Results indicate that modeling the shock force as a quasi-static force for MEMS with low-natural frequencies may lead to erroneous results. A criterion is obtained to distinguish between the dynamic and quasi-static responses of the MEMS.
KeywordsMicroelectromechanical Systems (MEMS)ShockReliability
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