Effect of Improving the Slip Properties of the Organic Materials on the Inorganic Filler in Heat Dissipated Pad

Abstract

The heat dissipated pad is made of composite mixing silicon or epoxy resin with thermal conductive inorganic fillers. The heat-dissipation material improves performance as the amount of thermal conductivity filler increases. However, the optimum recipe should be determined by considering the price and pad formability. In this study, high performance thermal pad is made of silicon resin mixed with Al2O3 as a thermally conductive filler. Since Al2O3 is low cost, it can use much filler. Al2O3 has improved slip-ability with organic coating on it to increase the viscosity of the slurry. The same process and the same recipe, could maximize the amount of the filler. As a result, the thermal conductivity is lower by 10%. But the viscosity is reduced by 60%, too. So form-ability is getting priority.