Although there are many lead-free soldering alloys on the market, none of them have ideal qualities. The researchers are combining binary alloys with a variety of additional materials to create the soldering alloys’ features. The eutectic Sn-9Zn alloy is among them. This paper investigated the mechanical and electrical properties of Sn-9Zn-x (Ag, Cu, Sb); {x = 0.2, 0.4, and 0.6} lead-free solder alloys. The mechanical properties such as elastic modulus, ultimate tensile strength (UTS), yield strength (YS), and ductility were examined at the strain rates in a range from 4.17 10 − 3 s − 1 to 208.5 10 − 3 s − 1 at room temperature. It is found that increasing the content of the alloying elements and strain rate increases the elastic modulus, ultimate tensile strength, and yield strength while the ductility decreases. The electrical conductivity of the alloys is found to be a little smaller than that of the Sn-9Zn eutectic alloy.
Binh, D.N. (2005) Investigations on the Properties of Sn-8Zn-3Bi Lead-Free and Sn-37Pb Eutectic Solder Alloys. Master’s Thesis. http://eprints.usm.my/6555/1/INVESTIGATIONS_ON_THE_PROPERTIES_OF_Sn-8Zn-3Bi_LEAD-FREE.pdf
Mishra, P. (2014) Determination and Characterisation of Lead Free Solder Alloys. Master’s Thesis, National Institute of Technology Rourkela.
Collins, M.N., Punch, J., Coyle, R., Reid, M., Popowich, R., Read , P., et al . (2011) Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions. IEEE Transactions on Components , Packaging and Manufacturing Tec h nology , 1, 1594-1600. https://doi.org/10.1109/TCPMT.2011.2150223
Ramli, M.I.I., Saud, N., Salleh, M.A.A.M., Derman, M.N. and Said, R.M. (2016) Effect of TiO 2 Additions on Sn-0.7Cu-0.05Ni Lead-Free Composite Solder. Micr o electronics Reliability , 65, 255-264. https://doi.org/10.1016/j.microrel.2016.08.011
Islam, R.A., Chan, Y.C., Jillek, W. and Islam, S. (2006) Comparative Study of Wetting Behavior and Mechanical Properties (Microhardness) of Sn-Zn and Sn-Pb Solders. Microelectronics Journal , 37, 705-713. https://doi.org/10.1016/j.mejo.2005.12.010
Chen, W.X., Xue, S.B., Wang, H. and Hu, Y.H. (2010) Reliability Studies of Sn–9Zn/Cu and Sn–9Zn–0.3 Ag/Cu Soldered Joints with Aging Treatment. Journal of Materials Science : Materials in Electronics , 21, 779-786. https://doi.org/10.1007/s10854-009-9993-1
Cheng, S., Huang, C.M. and Pecht, M. (2017) A Review of Lead-Free Solders for Electronics Applications. Microelectronics Reliability , 75, 77-95. https://doi.org/10.1016/j.microrel.2017.06.016
Union European (2003) 95/EC of the European Parliament and of the Council of 27 January 2003 on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment. Official Journal of the European Union , 37, 19-23.
Collins, M. N., Punch, J. and Coyle, R. (2012) Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors. Soldering & Surface Mount Technology , 24, 240-248. https://doi.org/10.1108/09540911211262520
Liu, L.J., Wu, P. and Zhou, W. (2014) Effects of Cu on the Interfacial Reactions Between Sn-8Zn-3Bi-xCu Solders and Cu Substrate. Microelectronics Reliability , 54, 259-264. http://Dx.Doi.Org/10.1016/J.Microrel.2013.10.001
EL-Daly, A.A. and Hammond, A.E. (2011) Development of High Strength Sn-0.7Cu Solders with the Addition of Small Amount of Ag and In. Journal of Alloys and Compounds , 509, 8554-8560. https://doi.org/10.1016/j.jallcom.2011.05.119
Hayes, S.M., Chawla, N. and Frear, D.R. (2009) Interfacial Fracture Toughness of Pb-Free Solders. Microelectronics Reliability , 49, 269-287. https://doi.org/10.1016/j.microrel.2008.11.004
(2016) Directive 2002/95/EC of the European Parliament and the Council. https://eur-lex.europa.eu/LexUriServ/LexUriServ.do?uri=OJ:L:2012:197:0038:0071:en:PDF
(2016) Act for Resource Recycling of Electrical and Electronic Equipment and Vehicles.
State Council of the Chinese Government Decree (2016) Management Methods for Restriction of the Use of Hazardous Substances in Electrical and Electronic Products. http://www.chinarohs.com
(2016) Restrictions on the Use of Certain Hazardous Substances (RoHS) in Electronic Devices. https://www.dtsc.ca.gov/restrictions-on-the-use-of-certain-hazardous-substances-rohs-in-electronic-devices
Abtew, M. and Selvaduray, G. (2000) Lead-Free Solders in Microelectronics. Mat e rials Science & Engineering : R : Reports , 27, 95-141.
Li, C.J., Yan, Y.F., Gao, T.T. and Xu, G.D. (2020) The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-XSb High-Temperature Lead-Free Solder. Materials , 13, Article 4443. https://doi.org/10.3390/ma13194443
Fouzder, T., Gain, A.K. and Chan, D.K. (2017) Microstructure, Wetting Characteristics and Hardness of Tin-Bismuth-Silver (Sn-Bi-Ag) Solders on Silver (Ag)-Surface Finished Copper (Cu) Substrates. Journal of Materials Science : Mat e rials in Electronics , 28, 16921-16931. https://doi.org/10.1007/s10854-017-7611-1
Fima, P., Gancarz, T. Pstrus´, J. and Sypien, A. (2012) Wetting of Sn-Zn-XIn (x= 0.5, 1.0, 1.5wt%) Alloys on Cu and Ni Substrates. Journal of Materials Engineering and Performance , 21, 595-598. https://doi.org/10.1007/s11665-012-0124-4
Ventura, T., Terzi, S., Rappaz, M. and Dahle, A.K. (2011) Effects of Solidification Kinetics on Microstructure Formation in Binary Sn-Cu Solder Alloys. Acta Materi a lia , 59, 1651-1658. https://doi.org/10.1016/j.actamat.2010.11.032
Ren, G. and Collins, M.N. (2017) The Effects of Antimony Additions on Microstructures, Thermal and Mechanical Properties of Sn-8Zn-3Bi Alloys. Materials & Design , 119, 133-140. https://doi.org/10.1016/j.matdes.2017.01.061
El-Daly, A.A., Swilem, Y., Makled, M.H., El-Shaarawy, M.G. and Abdraboh, A.M. Thermal and Mechanical Properties of Sn–Zn–Bi Lead-Free Solder Alloys. Journal of Alloys and Compounds , 484, 134-142.
Das, S.K., Sharif, A., Chan, Y.C., Wong, N.B. and Yung, W.K.C. (2009) Influence of Small Amount of Al and Cu on the Microstructure, Microhardness and Tensile Properties of Sn-9Zn Binary Eutectic Solder Alloy. Journal of Alloys and Co m pounds , 481, 167-172. https://doi.org/10.1016/j.jallcom.2009.03.017
Silva, B.L. and Spinellib, J.E. (2018) Correlations of Microstructure and Mechanical Properties of the Ternary Sn-9wt%Zn-2wt%Cu Solder Alloy. Materials Research , 21, E20170877. https://doi.org/10.1590/1980-5373-mr-2017-0877
AL-ALbawee, A. (2020) Development of Sn-9Zn Solder Alloy by Adding Bismuth, Diyala. Journal of Engineering Sciences , 13, 37-43. https://doi.org/10.24237/djes.2020.13405
Shalaby, R.M. (2012) Effect of Silicon Addition on Mechanical and Electrical Properties of Sn-Zn Based Alloys Rapidly Quenched from Melt. Materials Science and Engineering : A , 550, 112-117. https://doi.org/10.1016/j.msea.2012.04.041
EL-Daly, A.A. and Hammand, A.E. (2010) Elastic Properties and Thermal Behavior of Sn-Zn Based Lead-Free Solder Alloys. Journal of Alloys and Compounds , 505, 793-800. https://doi.org/10.1016/j.jallcom.2010.06.142
Huang, H.-Z., Wei, X.-Q., Tan, D.-Q. and Zhou, L. (2013) Effects of Phosphorus Addition on the Properties of Sn-9Zn Lead-Free Solder Alloy. International Journal of Minerals , Metallurgy , and Materials , 20, 563-567. https://doi.org/10.1007/s12613-013-0766-8
Hu, Y.-H., Xue, S.-B., Wang, H., Ye, H. Xiao, Z.-X. and Gao, L.-L. (2011) Effects of Rare Earth Element Nd on the Solderability and Microstructure of Sn-Zn Lead-Free Solder. Journal of Materials Science : Materials in Electronics , 22, 481-487. https://doi.org/10.1007/s10854-010-0163-2
Huang, H.Z., Huang, Q.S., Peng, S. and Zhou, L. (2010) Effects of Ag Addition on Properties of Sn-9Zn Lead-Free Solder Alloys. Rare Metal Materials and Enginee r ing , 39, 1702-1706. https://doi.org/10.1016/S1875-5372(10)60127-0
Chen, X., Hu, A.M., Li, M. and Mao, D.L. (2008) Study on the Properties of Sn-9Zn-XCr Lead-Free Solder. Journal of Alloys and Compounds , 460, 478-484. https://doi.org/10.1016/j.jallcom.2007.05.087
Billah, M.M. and Shorowordi, K.M. (2012) Effect of Micron Size Ni Particle Addition on Microstructure, Thermal and Mechanical Properties of Sn-9Zn Lead-Free Solder Alloy. Applied Mechanics and Materials , 229-231, 271-275. https://doi.org/10.4028/www.scientific.net/AMM.229-231.271
Gancarz, T. (2016) Physical, Thermal, Mechanical Properties and Microstructural Characterization of Sn-9Zn-XGa Alloys. Metallurgical and Materials Transactions A , 47, 326-333. https://doi.org/10.1007/s11661-015-3235-3
Esener, P.A., Demirel, B. and Aksöz, S. (2023) Effect of Sb and in Additives on Thermal and Electrical Properties of Sn-9Zn-4Bi Alternative Lead-Free Solder Alloy. Materials Chemistry and Physics , 296, Article 127223. https://doi.org/10.1016/j.matchemphys.2022.127223
Yavuzer, B., Özyürek, D. and Tunçay, T. (2020) Microstructure and Mechanical Properties of Sn-9Zn-XAl and Sn-9Zn-XCu Lead-Free Solder Alloys. Materials Science - Poland , 38, 34-40. https://doi.org/10.2478/msp-2020-0025
Wadud, M.A., Gafur, M.A., Qadir, M.R. and Rahman, M.O. (2015) Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys. Materials Sciences and Applications , 6, 1008-1013. https://doi.org/10.4236/msa.2015.611100
Wang, H., Xue, S.B., Zhao, F. and Chen, W.X. Effects of Ga, Al, Ag, and Ce Multi-Additions on the Wetting Characteristics of Sn-9Zn Lead-Free Solder. Rare Me t als , 28, 600-605. https://doi.org/10.1007/s12598-009-0115-2
Wang, H., Xue, S.B., Chen, W.X. and Zhao, F. Effects of Ga–Ag, Ga–Al and Al–Ag Additions on the Wetting Characteristics of Sn–9Zn-X-Y Lead-Free Solders. Jou r nal of Materials Science : Materials in Electronics , 20, 1239-1246. https://doi.org/10.1007/s10854-009-9859-6
Zhang, J.X., Xue, S.B., Xue, P. and Liu, S. Thermodynamic Reaction Mechanism of the Intermetallic Compounds of Sn x Nd y and Ga x Nd y in Soldered Joint of Sn-9Zn-1Ga-0.5Nd. Journal of Materials Science : Materials in Electronics , 26, 3064-3068. https://doi.org/10.1007/s10854-015-2798-5
Technofour Conductivity Meter Type 979. https://5.imimg.com/data5/SD/UG/HR/SELLER-1899117/digital-electrical-conductivity-meter-for-non-ferrous-metal.pdf
Chen, B.L. and Li, G.Y. (2004) Influence of Sb on IMC Growth in Sn-Ag-Cu-Sb Pb-Free Solder Joints in Reflow Process. Thin Solid Films , 462-463, 395-401. https://doi.org/10.1016/j.tsf.2004.05.063
Chen, B.L. and Li, G.Y. (2005) An Investigation of Effects of Sb on the Intermetallic Formation in Sn-3.5Ag-0.7Cu Solder Joints. IEEE Transactions on Components , Packaging and Manufacturing Technology , 28, 534-541. https://doi.org/10.1109/TCAPT.2005.848573
Islam, S.M.K.N., Sharif, A. and Alam, T. (2012) Intefacial Microstructure, Microhardness and Tensile Properties of Al Microparticle Doped Sn-9Zn Eutectic Pb-Free Solder Alloy for Microelectronics Applications. J ournal of Telecommunication , Electronic and Computer Engineering , 4, 35-39.
Wadud, M.A., Gafur, M.A., Qadir, R. and Rahman, M.O. (2015) Effect of Bismuth Addition on Structure and Mechanical Properties of Tin-9Zinc Soldering Alloy. Materials Sciences and Applications , 6, 792-798. https://doi.org/10.4236/msa.2015.69081
Luo, T.B., Hu, A., Hu, J., Li, M. and Mao, D.L. (2012) Microstructure and Mechanical Properties of Sn-Zn-Bi-Cr Lead-Free Solder. Microelectronics Reliability , 52, 585-588. https://doi.org/10.1016/j.microrel.2011.10.005
Ahmed, M., Fouzder, T., Sharif, A., Gain, A.K. and Chan, Y.C. (2010) Influence of Ag Micro-Particle Additions on the Microstructure, Hardness and Tensile Properties of Sn-9Zn Binary Eutectic Solder Alloy. Microelectronics Reliability , 50, 1134-1141. https://doi.org/10.1016/j.microrel.2010.03.017
Che, F.X., Zhu, W.H., Poh, E.S.W., Zhang, X.W. and Zhang, X.R. (2010) The Study of Mechanical Properties of Sn-Ag-Cu Lead-Free Solders with Different Ag Contents and Ni Doping under Different Strain Rates and Temperatures. Journal of A l loys and Compounds , 507, 215-224. https://doi.org/10.1016/j.jallcom.2010.07.160
Long, X., He, X. and Yao, Y. (2017) An Improved Unified Creep-Plasticity Model for SnAgCu Solder under a Wide Range of Strain Rates. Journal of Materials Science , 52, 6120-6137. https://doi.org/10.1007/s10853-017-0851-x
Al-Ezzi, A., Al-Bawee, A., Dawood, F. and Shehab, A.A. (2014) Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy. Journal of Ele c tronic Materials , 48, 8089-8095. https://doi.org/10.1007/s11664-019-07577-w
Peng, Y.Z., Li, C.J., et al . (2021) Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-XBi Solders. Metals , 11, Article 538. https://doi.org/10.3390/met11040538
Kamal, M. and Gouda, E.S. (2006) Enhancement of Solder Properties of Sn-9Zn Lead-Free Solder Alloy. Crystal Research and Technology , 41, 1210-1213. https://doi.org/10.1002/crat.200610751