Effect of Al on Zn and Mg on Zn-Al as Pb Free Solder Alloy
- 1 Department of Mechanical Engineering, Ahsanullah University of Engineering and Technology, Dhaka, Bangladesh
- 2 Department of Mechanical Engineering, Ahsanullah University of Engineering and Technology, Dhaka, Bangladesh
- 3 Department of Naval Architecture and Ocean Engineering, Bremen University of Applied Sciences, Bremen, Gemany
- 4 Bangladesh Council of Scientific and Industrial Research, Dhaka, Bangladesh
Abstract
The Zn-Al alloy has garnered immense attention in both fundamental and applied research. In this research, the bulk solder properties of Zn-xAl and Zn-5Al-xMg (x = 4, 5 and 6) systems were explored systematically and compositional, thermal, microstructural, mechanical, and electrical characteristics of these alloys are examined and contrasted appropriately. Differential Thermal Analysis (DTA) revealed that the addition of Al in Zn caused the reduction of the melting temperature of Zn from 419˚C to 376.3˚C and Mg in Zn-5Al caused reduction of the melting temperature of Zn-5Al from 376.3˚C to 343.7˚C, respectively. Microstructures of Zn-xAl alloys with different percentages of Al, exactly resembles to the Zn-Al binary phase diagram. When increasing the amount of Mg up to 6 wt% in Zn-5Al alloy, MgZn 2 phase increases gradually and consequently lamellar matrix decreased. Al and Mg addition in Zn and Zn-5Al alloy separately caused to increase the tensile strength of Zn and Zn-5Al alloy. Zn-6Al alloy exhibited the highest tensile strength and fracture strain. Aluminum (Al) is often added to zinc (Zn) alloys to enhance their mechanical properties, including hardness. Also, Mg addition in Zn-5Al caused to gradually increase the hardness of Zn-5Al alloy. With increasing the amount of Al from 4 to 6 wt%, electrical resistivity of the Zn based alloys gradually increased. Since the resistivity of β phase is higher than α phase, electrical resistivity of Zn-5Al-xMg alloys were also higher than Zn-5Al alloy. The lowest resistivity of Zn-5Al-xMg system was found to be 8.329 µΩ∙cm for Zn-5Al-5Mg alloy.
- Bader, W.G. (1975) Lead Alloys for High Temperature Soldering of Magnet Wire. Journal of Welding , 54, 370-375.
- Takaku, Y., Felicia, L., Ohnuma, I., Kainuma, R. and Ishida, K. (2007) Interfacial Reaction between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders. Journal of Electronic Materials , 37, 314-323. https://doi.org/10.1007/s11664-007-0344-9
- Yamada, Y., Takaku, Y., Yagi, Y., Nakagawa, I., Atsumi, T., Shirai, M., et al . (2007) Reliability of Wire-Bonding and Solder Joint for High Temperature Operation of Power Semiconductor Device. Microelectronics Reliability , 47, 2147-2151. https://doi.org/10.1016/j.microrel.2007.07.102
- Gueijman, S.F., Schvezov, C.E. and Ares, A.E. (2012) Tracking Interphases in Directionally Solidified Zn-Al Binary Alloys. Materials Performance and Characterization , 1, Article 20120017. https://doi.org/10.1520/mpc20120017
- Nagaoka, T., Morisada, Y., Fukusumi, M. and Takemoto, T. (2011) Selection of Soldering Temperature for Ultrasonic-Assisted Soldering of 5056 Aluminum Alloy Using Zn-Al System Solders. Journal of Materials Processing Technology , 211, 1534-1539. https://doi.org/10.1016/j.jmatprotec.2011.04.004
- Kim, Y.M., Oh, C., Roh, H. and Kim, Y. (2009) A New Cu-Zn Solder Wetting Layer for Improved Impact Reliability. 2009 59 th Electronic Components and Technology Conference , San Diego, 26-29 May 2009, 1008-1013. https://doi.org/10.1109/ectc.2009.5074135
- Lee, J., Kim, K., Suganuma, K., Takenaka, J. and Hagio, K. (2005) Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate. Materials Transactions , 46, 2413-2418. https://doi.org/10.2320/matertrans.46.2413
- Kim, S., Kim, K., Kim, S. and Suganuma, K. (2008) Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders. Journal of Electronic Materials , 38, 266-272. https://doi.org/10.1007/s11664-008-0550-0
- Takahashi, T., Komatsu, S., Nishikawa, H. and Takemoto, T. (2010) Improvement of High-Temperature Performance of Zn-Sn Solder Joint. Journal of Electronic Materials , 39, 1241-1247. https://doi.org/10.1007/s11664-010-1233-1
- Osório, W.R., Freire, C.M. and Garcia, A. (2005) The Effect of the Dendritic Microstructure on the Corrosion Resistance of Zn-Al Alloys. Journal of Alloys and Compounds , 397, 179-191. https://doi.org/10.1016/j.jallcom.2005.01.035
- Park, S.W., Sugahara, T., Kim, K.S. and Suganuma, K. (2012) Enhanced Ductility and Oxidation Resistance of Zn through the Addition of Minor Elements for Use in Wide-Gap Semiconductor Die-Bonding Materials. Journal of Alloys and Compounds , 542, 236-240. https://doi.org/10.1016/j.jallcom.2012.07.040