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Microstructure Evolution of W-Cu Alloy Wire
School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China
School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China
School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China
School of Science, Xi’an Jiaotong University, Xi’an, China
- 1 School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China
- 2 School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China
- 3 School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China
- 4 School of Science, Xi’an Jiaotong University, Xi’an, China
Materials Sciences and Applications·Volume 03 (2012)·Pages 157–162·Published 23 March 2012·DOI10.4236/msa.2012.33024
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Abstract
Microstructure of W-Cu alloy wire before and after hot-swaging was studied in this paper. Results show that a homogeneous microstructure of the W-Cu alloy wire was formed after hot-swaging treatment, and the tungsten particles were embedded in copper phases to form a networking structure; the W-Cu alloy wire has a microstructure of body-centered-cubic tungsten particles and face-centered-cubic copper phase, and did not change after hot-swaging. The intermediate phases have not been found during the process, but the size of the tungsten particles in the copper matrix becomes smaller. After hot-swaging, the treated W-Cu alloy wire has a relative density of 105.1%, and a conductivity of 47.2% IACS, the tensile and bending strength can be as large as 644 and 1600 MPa, respectively.
KeywordsHot-SwagingMicrostructureW-Cu AlloyWire
- W. G. Chen, M. Z. Chen and L. Q. Qian, “Effect of Doping on Electrical Arc Characteristic of W-Cu Electrical Contact Materials,” The Chinese Journal of Nonferrous Metals, Vol. 19, No. 11, 2009, pp. 2029-2036.
- M. Ardestani, H. Arabi, H. R. Rezaie and H. Razavizadeh, “Synthesis and Densification of W-30 wt%Cu Composite Powders Using Ammonium Meta Tungstate and Copper nitrate as Precursors,” International Journal of Refractory Metals and Hard Materials, Vol. 27, No. 4, 2009, pp. 796-800. doi:10.1016/j.ijrmhm.2009.01.001
- S. S. Ryu, Y. D. Kim and I. H. Moon, “Dilatometric Analysis on the Sintering Behavior of Nanocrystalline W-Cu Prepared by Mechanical Alloying,” Journal of Alloys and Compounds, Vol. 335, No. 1-2, 2002, pp. 233-240. doi:10.1016/S0925-8388(01)01805-9
- L. Li, Y. S. Wong, J. Y. H. Fuh and L. Li, “ Effect of TiC in Copper-Tungsten Electrodes on EDM Performance,” Journal of Materials Processing Technology, Vol. 113, No. 1-3, 2001, pp. 563-567. doi:10.1016/S0924-0136(01)00622-7
- W. G. Chen, Z. Y. Kang, H. F. Shen and B. J. Ding, “Arc Erosion Behavior of a Nanocomposite W-Cu Electrical Contact Material,” Rare Metals, Vol. 25, No. 1, 2006, pp. 37-42. doi:10.1016/S1001-0521(06)60011-9
- Z. L. Wang, X. J. Li, J. Q. Zhu, F. Mo, C. F. Zhao and L. H. Wang, “Dynamic Consolidation of W-Cu Nanocomposites from W-CuO Powder Mixture,” Materials Science and Engineering, Vol. 527, No. 21-22, 2010, pp. 6098-6101. doi:10.1016/j.msea.2010.05.077
- Y. J .Lee, B. H. Lee, G. S. Kim, D. G. Kim, D. S. Kim and Y. D. Kim, “Evaluation of Conductivity in W-Cu Composites through the Estimation of Topological Microstructures,” Materials Letters, Vol. 60, No. 16, 2006, pp. 2000-2003. doi:10.1016/j.matlet.2005.12.113
- S. P. Wen, R. L. Zong, F. Zeng, Y. Gao and F. Pan, “Evaluating Modulus and Hardness Enhancement in Evaporated Cu/W Multilayers,” Acta Materialia, Vol. 55, No. 1, 2007, pp. 345-351. doi:10.1016/j.actamat.2006.07.043
- X. H. Yang, S. H. Liang, X. H. Wang, P. Xiao and Z. K. Fan, “Effect of WC and CeO2 on Microstructure and Properties of W-Cu Electrical Contact Material,” International Journal of Refractory Metals and Hard Materials, Vol. 28, No. 2, 2010, pp. 305-311. doi:10.1016/j.ijrmhm.2009.11.009
- Z. F. Wang, Z. C. Liu and G. S. Jing. “Hermeticity of W-Cu Composites for Semiconductor Package,” The Chinese Journal of Nonferrous Metals, Vol. 9, No. 2, 1999, pp. 323-326.
- D. M. Lu, “Tungsten Copper Materials Used in Vacuum Switches and Electronics,” Powder Metallurgy Industry, Vol. 8, No. 6, 1998, pp. 32-35.