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Electrodeposition of Bi-Sb alloy using Cu electrodes
Department of Electrical and Computer Engineering, Akashi College of Technology, Akashi, Hyogo 674-8501, Japan
Department of Electrical Engineering, Kobe City College of Technology, Kobe, Hyogo 651-2194, Japan
- 1 Department of Electrical and Computer Engineering, Akashi College of Technology, Akashi, Hyogo 674-8501, Japan
- 2 Department of Electrical Engineering, Kobe City College of Technology, Kobe, Hyogo 651-2194, Japan
Materials Sciences and Applications·Volume 03 (2012)·Pages 492–494·Published 18 July 2012·DOI10.4236/msa.2012.37069
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Abstract
Bi-Sb alloys were grown by means of an electrodeposition method using Cu electrodes. The alloys were studied with the help of an x-ray diffractometer and an electron probe microanalysis. The both investigations have shown no trace of Cu in the obtained alloys. It can be concluded that Cu electrodes can be used for the deposition of Bi-Sb alloys; which results in an advantage of availability of the electrode.
KeywordsElectrodepositionEPMAXRDCompound SemiconductorsThermal Electric Generation
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