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Preparation and Gas Barrier Characteristics of Polysilazane-Derived Silica Thin Films Using Ultraviolet Irradiation
Department of Applied Chemistry, Faculty of Engineering, Shibaura Institute of Technology, Tokyo, Japan
Department of Applied Chemistry, Faculty of Engineering, Shibaura Institute of Technology, Tokyo, Japan
Department of Applied Chemistry, Faculty of Engineering, Shibaura Institute of Technology, Tokyo, Japan
- 1 Department of Applied Chemistry, Faculty of Engineering, Shibaura Institute of Technology, Tokyo, Japan
- 2 Department of Applied Chemistry, Faculty of Engineering, Shibaura Institute of Technology, Tokyo, Japan
- 3 Department of Applied Chemistry, Faculty of Engineering, Shibaura Institute of Technology, Tokyo, Japan
Materials Sciences and Applications·Volume 05 (2014)·Pages 105–111·Published 11 March 2014·DOI10.4236/msa.2014.53015
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Abstract
The gas barrier film formation technique using simultaneous photo-irradiation and heat-treat ment has been researched on alicyclic polyimide film coated with a polysilazane solution. A fine SiO 2 thin film on polyimide film was formed at low temperatures, which greatly improved the sub strate’s gas barrier characteristics by this technique. The values of gas barrier characteristics de pended on the substrate temperature at the time of photo-irradiation. For photo-irradiated thin film heat-treated to 150°C, the water vapor transmission rate and oxygen transmission rate fell below the equipment measurement limit of 0.02 g/m 2 /day and 0.02 cm 3 /m 2 /day, respectively. This polyimide film with a gas-barrier film coating has good transmittance in the region of visible light, heat resistance, and flexibility.
KeywordsPolysilazanePhoto-IrradiationGas Barrier CharacteristicsAlicyclic Polyimide Film
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