Optimization in Autoclave Process to Produce Durable Aluminium Composite
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Abstract
The purpose of this paper is to characterize adhesive bonding performance through the fracture evaluation. Failure modes correlate to the bond strength, in which the weak bond of adhesion will be considered unacceptable in the aircraft manufacture certification, whereas the cohesion bond as strong as adhesive itself is preferably accepted. The final quality of adhesive bonding process depends on several key variables during manufacturing. A good anodizing treatment is properly maintained in order to eliminate possible bond failures in the long term bond durability in service. This paper described the method to improve an adhesive joining for durable bonds through optimizing the process variable during autoclave curing. The process simulation utilized the drum peel test to describe the cohesive fracture phenomenon in which applicable on a daily load basis in commercial application.
- L. Dorn, “Adhesive Bonding—Terms and Definitions,” Training in Aluminium Application Technologies, Tutorial, Lecture 4701, Technische Universitat, Berlin, 2010. Internet Available: http://www.eaa.net/eaa/education/talat/lectures/4701.pdf
- ASTM D 1002-01, “Standard Test Method for Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading (Metal-to-Metal),” ASTM International, 2001.
- ASTM D 1781-1798, “Standard Test Method for Climbing Drum Peel for Adhesives,” ASTM International, 1998.
- S. Hojabr and S. R. Tanny, “Low Activation Temperature Adhesive Composition with High Peel Strength and Cohesive Failure,” United States Patent No. 6855432, E. I. du Pont de Nemours and Company, Wilmington, DE, 15 February 2005.
- T. Takano, “Method to Improve High Temperature Cohesive Strength with Adhesive Having Multi-Phase System,” United States Patent No. 7160946, National Starch and Chemical Investment Holding Corporation, New Castle, DE, 9 January, 2007.
- J. C. Engelaere, “Bonding Composition with Cohesive Failure,” United States Patent Application No. 200702 12504, Soplaril, 1 rue de l’Union, Rueil Malmaison, France, 13 September 2007.
- S. Kozakai, N. Ichiroku, A. Suzuki and T. Shiobara, “Adhesive Composition and Adhesive Film,” United States Patent No. 7364797, Shin-Etsu Chemical Co., Ltd., Tokyo, Japan, 29 April 2008.
- S. Hamano, “Adhesive Film,” United States Patent Application No. 20090286073, Kyodo Giken Chemical Co., Ltd, Saitama, Japan, 19 November 2009.
- A. Nishiura, H. Sugihara and K. Abe, “Adhesive Preparation,” United States Patent Application No. 20100041758, Ono Pharmaceutical Co., Ltd., Osakashi, Japan, 18 February 2010.
- B. D. Flinn, F. Ohuchi, M. Phariss, J. Satterwhite, J. Aubin and C. Keenen, “Improving Adhesive Bonding of Composites through Surface Characterization,” The Joint Advanced Materials and Structures Center of Excellence, CECAM, and AMTAS, University of Washington, 2010. Internet Available: http://depts.washington.edu/amtas/ev-ents/jams_08/21.Flinn.pdf
- M. J. Davis, “FAA Workshop on Best Practice in Adhesive Bonding, Principal Research Scientist,” Directorate General Technical Airworthiness, Royal Australian Air Force, 2010. Internet Available: http://www.niar.wichita.edu/NIARWorkshops/LinkClick.aspx?fileticket=iGBXdAGtWEk%3D&tabid=104&mid=569
- ASTM D 3762-03, “Standard Test Method for Adhesive-Bonded Surface Durability of Aluminum (Wedge Test),” ASTM International, 2003.