EBSD Analysis of the Submicron Width Fibber Shaped Grain Copper Fabricated by Drawing
- 1
- 2
- 3
- 4
- 5
Abstract
Several drawing processes of 3N pure copper (Cu) with ultra high reduction in area have been performed, and the texture has been observed using electron back scattered diffraction. It is well known that the texture of drawn Cu is closely related to its mechanical properties; in particular nanometer scale width fibber shaped grain is interesting. Previously, it was reported that drawing 3N Cu with around 95% reduction in area changes its mechanical properties. In the present experiment, grains have been changed from round to fiber-shaped, and subsequently, submicron-width fiber grains were generated with a 94.546% reduction in area. However, above 94.546% reduction in area, dynamic recrystallization occurred and then, prevented the grains to be finer. Further recrystallized grains influence on the macroscopic mechanical properties of Cu wire. Furthermore, the distribution of the misorientation angle at grain boundaries increased with an increase in the degree of reduction in area; in particular, the distribution drastically increased between 94.546% and 99.997%. Further, the frequency of coincidence of site lattice boundaries increased. The abovementioned variations in texture are closely related to mechanical properties.
- E. O. Hall, “Yield Point Phenomena in Metals and Alloys,” Plenum Press, New York, 1970.
- Y. Sakai, “Strength of Heavily Cold Worked Two-Phase-Copper Alloy,” Materia Japan, Vol. 36, 1997, pp. 692-696.
- T. G. Nieh and J. Wadsworth, “Hall-Petch Relation in Nanocrystalline Solid,” Scripta Metallurgica et Materialia, Vol. 25, No. 4, 1991, pp. 955-958. doi:10.1016/0956-716X(91)90256-Z
- P. G. Sanders, J. A. Eastman and J. R. Weertman, “Elastic and Tensile Behavior of Nanocrystalline Copper and Palladium,” Acta Materialia, Vol. 45, No. 10, 1997, pp. 4019-4025. doi:10.1016/S1359-6454(97)00092-X
- L. Lu, M. L. Sui and K. Lu, “Superplastic Extensibility of Nanocrystalline Copper at Room Temperature,” Science, Vol. 287, No. 5457, 2000, pp. 1463-1466. doi:10.1126/science.287.5457.1463
- L. L. Shaw, “Processing Nanostructured Materials: An Overview,” JOM Journal of the Minerals, Metals and Materials Society, Vol. 52, No. 12, 2000, pp. 41-45. doi:10.1007/s11837-000-0068-2
- Y. Saito, H. Utsunomiya, N. Tsuji and T. Sakai, “Novel ultra-High Straining Process for Bulk Materials- Development of the Accumulative Roll-Bonding (ARB) Process,” Acta Materialia, Vol. 47, No. 2, 1999, pp. 579-583.doi:10.1016/S1359-6454(98)00365-6
- Z. Horita, D. J. Smith, M. Furukawa, M. Nemoto, R. Z. Valiv and T. G. Langdon, “An Investigation of Grain Boundaries in Submicrometer-Grained Al-Mg Solid Solution Alloys Using High – Resolution Electron Microscope,” Journal of Materials Research, Vol. 11, No. 8, 1996, pp. 1880-1890. doi:10.1557/JMR.1996.0239
- A. Belyakov, W. Gao, H. Miura and T. Sakai, “Strain-Induced Grain Evolution in Polycrystalline Copper during Warm Deformation,” Metallurgical and Materials Transactions A, Vol. 29, No. 12, 1998, pp. 2957-2965. doi:10.1007/s11661-998-0203-1
- G. Wang, S. D. Wu, L. Zuo, C. Esling, Z. G. Wang and G. Y. Li, “Microstructure, texture, Grain Boundaries in Recrystallization Regions in Pure Cu ECAE Samples,” Materials Science and Engineering A, Vol. 346, No. 1-2, 2003, pp. 83-90. doi:10.1016/S0921-5093(02)00521-X
- H. Yamamoto and N. Inakazu, “On the Relation between Drawing Ratio and Mechanical Properties for Copper Wire,” Journal of the Japan Copper and Brass Research Association, Vol. 11, 1974, pp. 133-141.
- N. Inakazu and H. Kawakami, “Drawing,” In: H. Tanaka, Ed., The Japan Society of Technology of Plasticity, Corona Publishing Co. Ltd., Tokyo, 1994, pp. 80-86.