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A Top-Down Approach of Making Sn-3.5Ag Nanosolder Alloy by Swirl Method
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Materials Sciences and Applications·Volume 02 (2011)·Pages 1298–1301·Published 27 September 2011·DOI10.4236/msa.2011.29175
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Abstract
The nanoparticles of tin-silver solder, Sn-3.5Ag, of necklace geometry were made in a swirl batch. It was found that the addition of the element, Ag, did not vary the microstructure of the solder matrix, but Ag simply diluted into the Sn matrix randomly. The swirl flow facilitated the formation of particles with different sizes. It was found that the size distribution of the nanoparticles was strongly related to the height in the swirl batch. In addition, the aggregation of the nanoparticles was explored and the dispersion of the nanoparticles was achieved by adjusting the pH value of the solution near the neutral value.
KeywordsSwirl FlowParticle Size DistributionNanoparticle Aggregation
- Y. Li and C. P. Wong, “Recent Advances of Conductive Adhesives as a Lead-Free Alternative in Electronic Packaging: Materials, Processing, Reliability and Applications,” Materials Science and Engineering, R: Reports, Vol. 51, No. 1-3, 2006, pp. 1-35. doi:10.1016/j.mser.2006.01.001
- M. Abtew and G. Selvaduray, “Lead-Free Solders in Microelectronics,” Material Science Engineering, R: Reports, Vol. 27, No. 5-6, 2000, pp. 95-141.
- M. McCormack, S. Jin, G. W. Kammlott and H. S. Chen, “New Lead-Free, Sn-Ag-Zn-Cu Solder Alloy with Improved Mechanical Properties,” Applied Physics Letters, Vol. 63, No. 1, 1993, pp. 15-17.
- I.E. Anderson, J. C. Foley, B.A. Cook, J. Harringa, R.L. Terpstra and O. Unal, “Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability,” Journal of Electronic Materials, Vol. 30, No. 9, 2001, pp. 1050-1059. doi:10.1007/s11664-001-0129-5
- P.T. Vianco and A.C. Claghorn, “Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis,” Soldering & Surface Mount Technology, Vol. 8, No. 3, 1996, pp. 12-18. doi:10.1108/09540919610777708
- S. A. Maier, M. L. Brongersma, P. G. Kik, S. Meltzer, A. A. G. Requicha and H. A. Atwater, “Plasmonics a Route to Nanoscale Optical Devices,” Advanced Materials, Vol. 13, No. 19, 2001, pp. 1501-1505. doi:10.1002/1521-4095(200110)13:19 3.0.CO;2-Z
- Z. Zha, S. Qiao, J. Jiang, Y. Wang, Q. Miao and Z. Wang, “Barbier-Type Reaction Mediated with Tin Nano-Particles in Water,” Tetrahedron, Vol. 61, No. 9, 2005, pp. 2521-2527. doi:10.1016/j.tet.2004.12.063
- M. Athar, U. C. Kothyari and R. J. Garde, “Distribution of Sediment Concentration in the Vortex Chamber Type Sediment Extractor,” International Journal of Hydraulic Research, Vol. 41, No. 4, 2003, pp. 427-438. doi:10.1080/00221680309499987
- K. S. Le Corre, E. Valsami-Jones, P. Hobbs, B. Jefferson and S. A. Parsons, “Agglomeration of struvite crystals,” Water Research, Vol. 41, No. 2, 2007, pp. 419-425. doi:10.1016/j.watres.2006.10.025
- Y. Zhao, Z. Zhang and H. Dang, “Preparation of Tin Nanoparticles by Solution Dispersion,” Material Science and Engineering A, Vol. 359, No. 1-2, 2003, pp. 405-407. doi:10.1016/S0921-5093(03)00395-2
- A. Bhardwaj, P. Srivastava and H. K. Sehgal, “Chemically Deposited PbSe Nanoparticle Films Variation in Shape and Size,” Journal of Electrochemical Society, Vol. 154, No. 10, 2007, pp. 83-86. doi:10.1149/1.2763963