Mechanical Properties of Micro- and Nanostructured Copper Films

¹ The Ural State Mining University, Ekaterinburg, Russia

² The Ural State Mining University, Ekaterinburg, Russia

³ The Ural State Mining University, Ekaterinburg, Russia

⁴ The Ural State Mining University, Ekaterinburg, Russia

Abstract

Mechanical properties of electrodeposited and electroless copper with nano- and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation.

KeywordsNano- and Microcrystalline MaterialsHall-Petch RelationYield Point StressGrain Boundary Hardening CoefficientNonequilibrium Grain Boundaries

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Mechanical Properties of Micro- and Nanostructured Copper Films

Abstract

References (9)