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Effect of Prior-Heat Treatments on the Creep Behavior of an Industrial Drawn Copper
Laboratory of Metallicans Semiconductor Materials, University of Biskra, Biskra, Algeria
Laboratory of Metallicans Semiconductor Materials, University of Biskra, Biskra, Algeria
Laboratory of Metallicans Semiconductor Materials, University of Biskra, Biskra, Algeria
- 1 Laboratory of Metallicans Semiconductor Materials, University of Biskra, Biskra, Algeria
- 2 Laboratory of Metallicans Semiconductor Materials, University of Biskra, Biskra, Algeria
- 3 Laboratory of Metallicans Semiconductor Materials, University of Biskra, Biskra, Algeria
World Journal of Condensed Matter Physics·Volume 02 (2012)·Pages 241–245·Published 15 November 2012·DOI10.4236/wjcmp.2012.24041
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Abstract
The effect of prior-heat treatments at 500℃, 600℃ and 700℃ on the creep behavior of an industrial drawn copper has been studied under constant stresses (98, 108 and 118 MPa) and temperatures (290℃ and 340℃). The results revealed that the creep behavior and the creep life of the material depend strongly on these prior-heat treatments. The apparent activation energy Q c for different creep tests of a drawn copper wire was calculated. The fracture mechanism of the material is characterized using optical microscopy.
KeywordsCopperCreepDrawn WireHeat Treatment
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