For many years, a Lorentz factor of L = 1/3 has been used to describe the local electric field in thin amorphous dielectrics. However, the exact meaning of thin has been unclear. The local electric field E loc modeling presented in this work indicates that L = 1/3 is indeed valid for very thin solid dielectrics (t diel ≤ 20 monolayers) but significant deviations from L = 1/3 start to occur for thicker dielectrics. For example, L ≈ 2/3 for dielectric thicknesses of t diel = 50 monolayers and increases to L ≈ 1 for dielectric thicknesses t diel > 200 monolayers. The increase in L with t diel means that the local electric fields are significantly higher in thicker dielectrics and explains why the breakdown strength E bd of solid polar dielectrics generally reduces with dielectric thickness t diel . For example, E bd for SiO 2 reduces from approximately E bd ≈ 25 MV/cm at t diel = 2 nm to E bd ≈ 10 MV/cm at t diel = 50 nm. However, while E bd for SiO 2 reduces with t diel , all SiO 2 thicknesses are found to breakdown at approximately the same local electric field (E loc ) bd ≈ 40 MV/cm. This corresponds to a coordination bond strength of 2.7 eV for the silicon-ion to transition from four-fold to three-fold coordination in the tetrahedral structure.
KeywordsDielectricsDielectric BreakdownLocal Electric FieldLorentz FactorTime-Dependent Dielectric BreakdownTDDBBond BreakageThermochemical E-Model
Mossotti, O. (1850) Mem. di mathem. e fisica in Modena. 24, 49.
Clausius, R. (1879) Die mechanische U’grmetheorie. 2, 62.
Lorentz, H. (1915) The Theory of Electrons and Its Application to the Phenomena of Light & Radiant Heat. 2nd Edition, Dover Publications, New York.
McPherson, J. and Mogul, H. (1998) Underlying Physics of the Thermochemical E Mode in Describing Low-Field Time-Dependent Dielectric Breakdown in SiO2 Thin Films. Journal of Applied Physics, 84, 1513. http://dx.doi.org/10.1063/1.368217
Kittel, C. (1971) Introduction to Solid State Physics. 4th Edition, John Wiley Publishing, New York.
Ashcroft, N. and Mermin, N. (1976) Solid State Physics. Harcourt Brace College Publishers, New York.
McPherson, J. (2015) Lorentz Factor Determination for Local Electric Fields in Semiconductor Devices Utilizing Hyper-Thin Dielectrics. Journal of Applied Physics, 118, Article ID: 204106. http://dx.doi.org/10.1063/1.4936271
Nijboer, R. and De Wette, F. (1958) The Internal Field in Dipole Lattices. Physica, 24, 422.
Vanzo, D., Topham, B. and Soos, Z. (2014) Dipole-Field Sums, Lorentz Factors, and Dielectric Properties of Organic Molecular Films Modeled as Crystalline Arrays of Polarizable Points. Advanced Functional Materials, 25, 2004-2012. http://dx.doi.org/10.1002/adfm.201402405
Mueller, H. (1935) Theory of the Photo-Elastic Effect of Cubic Crystals. Physical Review, 47, 947. http://dx.doi.org/10.1103/PhysRev.47.947
Klein, N. and Gafni, H. (1966) The Maximum Dielectric Strength of Thin Silicon Oxide. IEEE Transactions on Electron Devices, 13, 281-289. http://dx.doi.org/10.1109/T-ED.1966.15681
Dumin, D., Ed. (2002) Oxide Reliability—A Summary of Silicon Oxide Wearout, Breakdown, and Reliability. World Scientific Publishing, Singapore, 173
Kim, H. and Shi, F. (2001) Thickness Dependent Dielectric Strength of a Low-Permittivity Dielectric Film. IEEE Transactions on Dielectrics and Electrical Insulation, 8, 248-252.
Chen, G. and Zhao, J. (2012) Space Charge and Thickness Dependent DC Electrical Breakdown of Solid Dielectrics. 2012 IEEE International Conference on High Voltage Engineering and Applications, Shanghai, 17-20 September 2012, 12-15.
Suehle, J. (2002) Ultrathin Gate Oxide Reliability: Physical Models, Statistics. IEEE Transactions on Electron Devices, 49, 958.
Wu, E., Vayshenker, A., Nowak, E., Sune, J., Vollertsen, R., Lai, W. and Harmon, D. (2002) Experimental Evidence of TBD Power-Law for Voltage Dependence of Oxide Breakdown in Ultrathin Gate Oxides. IEEE Transactions on Electron Devices, 49, 2244-2253.
Degraeve, R., Groseneken, G., Bellens, R., Ogier, J., Depas, M., Roussel, J. and Maes, H. (1998) New Insights in the Relation between Electron Trap Generation and the Statistical Properties Breakdown. IEEE Transactions on Electron Devices, 45, 904-911. http://dx.doi.org/10.1109/16.662800
Sune, J., Jimenez, D. and Miranda, E. (2001) Breakdown Modes and Breakdown Statistics of Ultrathin SiO2 Gate Oxides. International Journal of High Speed Electronics and Systems, 11, 789. http://dx.doi.org/10.1142/S0129156401001003
McPherson, J. (2012) Time Dependent Dielectric Breakdown Physics-Revisited. Microelectronics Reliability, 52, 1753-1760. http://dx.doi.org/10.1016/j.microrel.2012.06.007
Lee, S.-C. and Oates, A. (2015) On the Voltage Dependence of Copper/Low-k Dielectric Breakdown. 2015 IEEE International Reliability Physics Symposium, Monterey, 19-23 April 2015, 3A.3.1.
Higgins, R. and McPherson, J. (2009) TDDB Evaluations and modeling of Very High-Voltage (10 kV) Capacitors. 2009 IEEE International Reliability Physics Symposium, Montreal, 26-30 April 2009, 432-436.
McPherson, J.W., Kim, J., Shanware, A., Mogul, H. and Rodriguez, J. (2003) Trends in the Ultimate Breakdown Strength of High Dielectric Constant Materials. IEEE Transactions on Electron Devices, 50, 1771.
McPherson, J. (2004) Determination of the Nature of Molecular Bonding in Silica from Time-Dependent Dielectric Breakdown Data. Journal of Applied Physics, 95, 8101. http://dx.doi.org/10.1063/1.1728288
McPherson, J. and Baglee, D. (1985) Acceleration Factors for Thin Gate Oxide Stressing. International Reliability Physics Proceedings, Orlando, 25-29 March 1985, 1-5.
Chen, I., Holland, S. and Hu, C. (1985) A Quantitative Physical Model for TDDB in SiO2. International Reliability Physics Proceedings, Orlando, 25-29 March 1985, 24-31.
McPherson, J. and Mogul, H. (1998) Underlying Physics of the Thermochemical E Mode in Describing Low-Field Time-Dependent Dielectric Breakdown in SiO2 Thin Films. Journal of Applied Physics, 84, 1513. http://dx.doi.org/10.1063/1.368217
McPherson, J., Kim, J., Shanware, A. and Mogul, H. (2003) Thermochemical Description of Dielectric Breakdown in High Dielectric Constant Materials. Applied Physics Letters, 82, 2121. http://dx.doi.org/10.1063/1.1565180
Suehle, J. (2002) Ultrathin Gate Oxide Reliability: Physical Models, Statistics. IEEE Transactions on Electron Devices, 49, 958.
Wu, E., Vayshenker, A., Nowak, E., Sune, J., Vollertsen, R., Lai, W. and Harmon, D. (2002) Experimental Evidence of TBD Power-Law for Voltage Dependence of Oxide Breakdown in Ultrathin Oxides. IEEE Transactions on Electron Devices, 49, 2244-2253. http://dx.doi.org/10.1109/TED.2002.805606