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The Journal of Electronics Cooling and Thermal Control (JECTC) is a quarterly, peer-reviewed, academic journal. It aims to provide a vehicle for the exchange and dissemination of original research results, technical notes, and state-of-the-art reviews pertaining to the electronic cooling and thermal system control tec…
G. Casano, M. W. Collins, S. Piva
An experimental study has been made of the fluid dynamics performance of electronic equipment designed to cool a heat sink in the form of a finned duct. The apparatus consists of a channel of rectangular section containing the finned duct. A forced airflow is…
Shigeki Hirasawa, Atsushi Fujiwara, Tsuyoshi Kawanami, Katsuaki Shirai
Forced convection cooling of fins on a high-temperature wall has been used to cool high-power electronic devices. We numerically calculated and experimentally measured the forced convection heat transfer coefficient and pressure drop of a diamond-shaped fin-a…
Takayuki Atarashi, Tetsuya Tanaka, Shigeyasu Tsubaki, Shigeki Hirasawa
Forced-air convection cooling of high-power electronic devices is widely used, but it has a problem that a rise in temperature of the air used to cool the upstream devices decreases the cooling capa-bility for the downstream devices. In this study we made an…
Naoko Matsumoto, Toshio Tomimura, Yasushi Koito
In order to comply with the recent demand for downsizing of the electric equipment, the minia- turization and the improvement in heat transfer performance of a heat sink under natural air-cooling are increasingly required. This paper describes the experimenta…
Adam Martin, Lucius Akalanne
Passive cooling techniques are cost effective and reliable methods of cooling remote radio heads (RRH). This paper investigates the plausibility of a passive cooling technique involving exchanging warm air, from the internal cavity of RRHs, with fresh ambient…
Samah G. Babiker, Shuai Yong, Mohamed O. Sid-Ahmed, Xie Ming
In this paper, a one-dimensional multilayer is optimized for potential applications as thermophotovoltaic (TPV) selective emitter. The proposed TPV emitter was fabricated through a magnetron sputtering process by using the radio frequency (RF) magnetron sputt…
Cosimo Buffone
This paper presents and describes the test campaign of a low-cost Loop Heat Pipes (LHP) design. LHP have been around for many decades now. Their potential as passive heat transfer devices has been widely demonstrated in numerous both ground- and space-based a…
Sho Okutani, Hosei Nagano, Shun Okazaki, Hiroyuki Ogawa, Hiroki Nagai
This paper presents fabrication and testing of a multiple-evaporator and multiple-condenser loop heat pipe (MLHP) with polytetrafluoroethylene (PTFE) porous media as wicks. The MLHP has two evaporators and two condensers in a loop heat pipe in order to adapt…
Abdul Rahim A. Khaled, Abdullatif A. Gari
This work analyzes heat transfer through a wall containing triangular fins partially embedded in its volume. The coupled heat diffusion equations governing each constituent are solved numerically using an iterative finite volume method. A well bracketed effec…
Yasushi Koito, Shoryu Okamoto, Toshio Tomimura
The 45 。 heat spreading angle is familiar among thermal designers. This angle has been used for thermal design of electronic devices, and provides a heat spreading area inside a board, e.g. printed circuit board, which is placed between a heat dissipating ele…
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The Journal of Electronics Cooling and Thermal Control (JECTC) is a quarterly, peer-reviewed, academic journal. It aims to provide a vehicle for the exchange and dissemination of original research results, technical notes, and state-of-the-art reviews pertaining to the electronic cooling and thermal system control tec… All articles are open access under a CC BY 4.0 licence, with authors retaining copyright.
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